🔒 Strict IP Protection & Data Security✈️ AS9100 & IATF 16949 Standards⚡ 100% Manufactured in South Korea · Express Delivery
Schematics & firmware source protected under NDA and controlled accessIndustrial high-reliability standards (IPC Class 3 & IATF 16949)Produced on our own Korean lines, shipped after FCT functional testing
Embedded controller HW/FW design & PCBA production specialists

Embedded Controller HW/FW Design & PCBA Specialists in South Korea

MCU/SoC circuit design, embedded firmware (C/C++, FreeRTOS), noise-optimized PCB artwork and high-precision SMT assembly. Solve complex hardware development with a single dedicated engineering team.

  • MCU/SoC Circuit Design
  • Embedded Firmware (RTOS / Bare-Metal)
  • CAN / RS485 / Industrial IoT
  • IPC Class 3 SMT Production
  • 100% FCT Functional Test

Our Engineering Commitment

DHL Express / FedEx / UPSISO 9001 · AS9100D · RoHS Compliant
450+
Engineers & Production Specialists (Korean network)
6 Lines
Fully Automated SMT Lines
Class 3
High-Reliability IPC Standard
1.4M/day
SMT Placement Capacity · 3D X-Ray & CT

Get a PCB & PCBA Quote

Send us what you have. Our engineers will help complete the manufacturing data package.

Live

Recommended files

PCB Fabrication
Gerber · ODB++ · IPC-2581 · NC Drill · Fabrication Drawing
PCB Assembly
Gerber/ODB++ · BOM · Pick & Place (Centroid) · Assembly Drawing · Schematic (optional)

※ Required: Please click the process(es) you need (multi-select)

All design files are encrypted during transfer and strictly protected under robust IP security protocols.

Detailed DFM feedback is provided after receiving sufficient manufacturing data.

DFM Review: 1–3 Business Days. Send your schematic or drawing; our engineers will advise on stack-up, fabrication data, and DFM requirements.

Encrypted & Confidential
DFM Review: 1–3 Business Days
SPI · AOI · 3D X-Ray · E-Test

Spec in. Working PCBA out. Made in Korea. — MCU/SoC circuit design, C/C++ firmware, CAN/RS485 interfaces, SMT production and 100% FCT functional testing through one accountable partner.

Embedded Engineering Scope

From idea stage to a finished controller PCBA

We adapt the full embedded development path to whatever you already have — a spec sheet, a schematic, or finished Gerber data.

STEP 1. Input (your material)

Any level of documentation works

We propose the best development and production path for the material you have.

  • Functional spec / block diagram: operating scenarios, I/O definition
  • Circuit data: schematic, BOM (you may specify the MCU)
  • Mechanical / enclosure: board outline (DXF/3D), connector positions
* Initial consultation is possible even without complete drawings
STEP 2. Dedicated Core Engineering

Integrated embedded HW & FW design

Hardware and firmware are designed in parallel to cut development time to a minimum.

  • HW design: optimal MCU/SoC selection, power (PMIC) and CAN/RS485/BLE interfaces
  • FW development: C/C++, FreeRTOS, drivers and control logic
  • Artwork & DFM: EMC-optimized routing with manufacturability verified up front
* Source code and design data ownership can be fully assigned to you
STEP 3. Output (finished delivery)

A running board, ready to deploy

You receive a verified, fully assembled PCBA that has passed functional testing.

  • Functionally tested PCBA: 100% jig-based FCT on every unit
  • Complete IP data: schematic, Gerber, BOM, firmware binary/source
  • Quality report: AOI / 3D X-Ray and DFM inspection results
* Continuous support from prototype samples through volume production

Need cost reduction or component replacement on an existing controller?

We also handle board redesign for obsolete MCU replacement, BOM cost down and noise improvement.

Discuss redesign / development

Predictable Workflow

From Design Files to Delivered PCBA

Select a step to see exactly what happens and what you receive.

01. Upload

Send Gerber/ODB++, BOM, and Pick & Place data — or just a schematic. Files are encrypted in transit and handled confidentially, shared only with the assigned engineers.

SMT / PCBA

SMT Assembly Capabilities

High-precision SMT for prototype, NPI and production.

Component Size
0402 standard · 0201 capability available
Packages Supported
BGA, QFN, LGA, fine-pitch components
Assembly Types
SMT + IMT mixed assembly · Lead-free & RoHS compliant
SMT Infrastructure
6 fully automated SMT lines (up to 1.4M placements/day)
Quality & Inspection
SPI, AOI, 3D X-Ray / CT inspection, ESD-controlled production

Component Sourcing

One BOM. One Accountable Supply Chain.

Choose the sourcing model that fits your program — we manage the rest.

Turnkey

Complete component sourcing + PCB fabrication + assembly under one purchase order.

Consigned

You supply all components; we handle kitting verification, fabrication, and assembly.

Mixed

Customer-supplied critical parts combined with team-sourced commodity components.

Component management included

  • MPN verification
  • Lead-time check
  • Authorized distributor sourcing
  • EOL / obsolete review
  • Alternative part review

No component substitution without customer approval.

PCB Fabrication

Advanced PCB Fabrication

From fast-turn prototypes to high-reliability multilayers.

Product Scope & Capabilities

PCB TypeStandard SpecsAdvanced / Special SpecsKey Features
Heavy Oz2–8L10–18L3–10oz Copper Power Supply Board & Bus Bar
Metal Base1–2L (Al/Cu base)4–12LMetal Plate High Heat Dissipation (Heat-sink)
BVH (Blind/Buried Via)4–12L14–24LBlind Via Hole & Buried Via Hole
HDI6–8L10–16LHigh-Technology Multilayer PCB
Flex-Rigid4–8L10–22LHigh-Layer Flex-Rigid / HDI Flex-Rigid
High-Count Multilayer4–20L22–42LHigh-Layer MLB & Probe Cards
Hybrid~8L10–24LSpecial Materials (Rogers, Taconic, Nelco, Isola, PI)

Technical Design Rules & Engineering Limits

ParameterStandardNormally availableAdvancedAvailable by engineering reviewMaximumProject-specific / factory confirmation
Layer Count2–20L22–32L34–42L
Board Thickness0.4–3.2 mm (16–126 mils)4.8 mm (190 mils)Max 6.0 mm (240 mils)
Min Line Width / Space0.1 mm (4 mils)0.075 mm (3 mils)0.05 mm (2 mils)
Min Mechanical Hole Size0.25 mm (10 mils)0.15–0.2 mm (6–8 mils)0.1 mm (4 mils)
Min Laser Hole Size0.10 mm (4 mils)0.08–0.09 mm (3.15–3.54 mils)0.08–0.09 mm (3.15–3.54 mils)
Max Board Size507×607 mm (20×24″)600×800 mm (24×31″)600×800 mm (24×31″)
Impedance Control±10%±7%±7%

Values are typical reference capabilities. Final confirmation is provided after engineering review and DFM analysis.

Quality

DFM Review & Quality Documentation

Know exactly what we check — and exactly what you receive.

Our DFM review includes

  • Trace / space
  • Drill & via structure
  • Copper balance
  • Stack-up
  • Impedance requirements
  • Solder mask
  • Component clearance
  • BGA / QFN considerations
  • BOM availability & EOL risks
  • Panelization & depaneling method
  • Solder paste & stencil considerations
  • Thermal relief & copper pour balance

Available quality documents

  • AOI report
  • 3D X-Ray report
  • Electrical test report
  • First Article Inspection (FAI) report
  • Certificate of Conformance (COC)
  • RoHS / REACH compliance
  • Lot traceability records
Request DFM Review & Inspection Specs

Detailed DFM feedback is provided after receiving sufficient manufacturing data.

Lead Times & Logistics

Predictable Lead Times, Delivered Worldwide

Quote Response
Within 2 business days
DFM Review
1–3 business days
Production & Assembly
Project dependent
Shipping
3–5 business days via express

Global Shipping

DHL Express, FedEx, UPS, or your own freight forwarder — with DAP and DDP Incoterms options.

  • DHL Express
  • FedEx
  • UPS
  • Customer Freight Forwarder
  • DAP / DDP Incoterms

Manufactured in South Korea. Delivered worldwide.

Supply Chain Diversification

Diversify Your PCB & PCBA Supply Chain with Korean Manufacturing

A stable, allied-nation manufacturing base with mature electronics infrastructure, engineering depth, and predictable export logistics.

Manufactured in South Korea

Manufactured in South Korea through a qualified Korean manufacturing network under our engineering supervision and quality control — with full process traceability from fabrication to final inspection.

Geopolitical Stability & Supply Chain Safety

A trusted allied-nation alternative for defense and advanced tech programs, with IP strictly protected under Korean law.

Fast Turnaround & Superior Technical Communication

English-fluent senior engineers answer within hours — no translation layers between your design intent and the production floor.

Technical Excellence

Core Competencies & Technical Excellence

IPC Class 3 & High-Reliability PCBs

Specialized in Defense, Aerospace, and Industrial Grade. Expertise in Rigid-Flex PCBs and Multi-Layer builds from 2 to 42 layers.

Continuous Investment in Next-Gen Infrastructure

Powered by state-of-the-art machinery and automated lines—including pulse plating and ultra-fine pattern tech—ensuring flawless precision for high-density builds.

6 Advanced SMT Assembly Lines

Equipped for components down to 0201 (01005 available upon engineering review) and high-density mounting at up to 1.4 million placement points per day.

Proactive DFM (Design for Manufacturability)

We don't just print your files — we review them and return a defect prevention proposal. DFM Review: 1–3 Business Days.

Quality & Security

State-of-the-Art Smart Factory Network in South Korea

A qualified Korean manufacturing network across Seoul, Incheon, and Ansan — orchestrated as a single production layer.

ESD-protected PCB assembly workstation for embedded controller PCBA at NexTurn PCB, South Korea

PCB Assembly

Manual PCB assembly with ESD protection and IPC Class 3 workmanship.

3D X-Ray inspection for BGA and hidden solder joints in NexTurn PCB controller boards

3D X-Ray Inspection

3D X-Ray and CT inspection for BGA, QFN and hidden solder joints — void ratio, bridging, and alignment verification.

AOI automated optical inspection of component placement and solder quality for NexTurn PCB SMT assembly

AOI Automated Optical Inspection

Automated optical inspection for component presence, polarity, offset, and solder fillet quality against IPC acceptance criteria.

Automated copper plating line for high-density PCB production panels at NexTurn PCB, South Korea

Auto-Plating Lines

Automated acid-copper plating line for uniform deposition across high-density panels, maintaining consistent copper thickness ±5%.

Quality & Compliance

Quality & Compliance

Certifications and standards applied across our qualified Korean manufacturing network.

  • ISO 9001Quality management systemDocumented, audited process control on every order.
  • AS9100DAerospace quality managementTraceability and configuration control for high-reliability programs.
  • IATF 16949Automotive quality managementProcess discipline suited to automotive-grade volume builds.
  • ISO 14001Environmental managementControlled chemical handling and waste management.
  • IPC-A-600Bare board acceptabilityBoards judged against IPC Class 2 or Class 3 criteria as specified.
  • IPC-A-610Assembly acceptabilitySolder joint and workmanship criteria applied to every PCBA.
  • ULMaterial & flammability listingUL-recognized laminates with UL marking available on request.
  • RoHS / REACHSubstance complianceLead-free process with compliance declarations issued per lot.

All production within the NexTurnPCB network is strictly executed in compliance with these international quality standards and IPC workmanship guidelines.

Data Scope

Drawing & Technical Specification Scope

Send what you have. We handle the rest of the data package.

Input

What you send us

  • Schematic
  • Component Layout (Dimension)
  • Gerber Data

Output

What we deliver back

  • Full Artwork
  • Fabrication Drawing
  • Gerber
  • Assembly Drawing

DFM Feedback

Target Turnaround

  • DFM Review: 1–3 Business Days
  • Defect prevention proposal
  • Stack-up & impedance advice
Proven Engineering Case Studies

Embedded controller programs we designed and mass-produced

Circuit redesign, firmware optimization and production defect elimination — measured outcomes from real programs.

Industrial Controller• MCU replacement & noise optimization

Industrial Motor & Communication Controller

Challenge (customer problem)

Production had stopped because the original MCU went end-of-life, and heavy motor-drive noise was causing frequent CAN/RS485 communication errors.

Engineering Solution
  • Circuit redesign and pin mapping onto a readily available STM32 MCU
  • Rewritten FreeRTOS-based embedded firmware driver architecture
  • 4-layer PCB artwork with split GND planes and noise shielding patterns
  • In-house FCT (Functional Circuit Test) jig to cut production test time
Key Quantitative ResultsBased on measured data
Unit production cost
22% lower
Development & validation time
35% shorter
Communication failure rate
0.00%

Have a similar technical challenge or embedded board project?

Talk to an engineer about a similar project

Representative process visuals

Multilayer PCB with copper traces and plated vias for embedded controller hardware at NexTurn PCB
Multilayer PCB
3D X-Ray inspection view for BGA solder joints at NexTurn PCB
3D X-Ray inspection view
AOI inspection view of assembled PCB components and solder joints at NexTurn PCB
AOI inspection view
Panelized PCB production boards for repeatable SMT PCBA assembly at NexTurn PCB, South Korea
Production panel

Illustrative process visuals — not customer-specific product photography.

Frequently Asked Questions

Embedded controller development & production FAQ

The questions customers ask most about how projects run, IP ownership, and production quality testing.

After development is complete and the final payment is settled, ownership of the schematic, Gerber files, BOM and the embedded firmware source code (C/C++, FreeRTOS) belongs 100% to your company. An NDA is signed before the contract to protect your core technology IP.

Yes. Share your I/O requirements, communication interfaces (CAN, RS485, BLE, etc.) and mechanical dimension limits, and our embedded engineers will propose the component selection (MCU/PMIC) and system architecture for you.

New hardware/firmware development typically takes about 3 to 6 weeks up to prototype sample delivery. NRE is calculated based on MCU selection, PCB layer count and firmware control logic complexity, and options to rebate or spread NRE against production volume can be discussed.

We provide dedicated board redesign services for obsolete-part replacement and cost reduction. We select a reliably available alternative MCU, remap the circuit and port the firmware, cutting BOM cost by 15–30% on average with no loss of function.

We do not stop at SMT assembly: we build the FCT (Functional Circuit Test) jig and the automated test program dedicated to your controller in house. Power-up, I/O signals, communication and LED/motor operation are tested on 100% of units, so boards ship in a zero-defect state.

Didn't find the answer you were looking for?
An engineer will review your schematic and specification directly and reply one-to-one.
Talk directly to an engineer

Have a PCB or PCBA Project?

Send your files and get engineering feedback with a quote — DFM Review: 1–3 Business Days.

Detailed DFM feedback is provided after receiving sufficient manufacturing data.